Memsen Electronics has a total of 44 patents globally, out of which 31 have been granted. Of these 44 patents, more than 70% patents are active. China is where Memsen Electronics has filed the maximum number of patents, followed by The United States of America and Taiwan. Parallelly, China seems to be the main focused R&D centre and also is the origin country of Memsen Electronics.
Memsen Electronics was founded in 2010. The company specializes in innovative Micro-Electro-Mechanical Systems (MEMS) devices and integrated circuits. Known for advanced sensor technologies, it develops high-performance solutions like MEMS pressure sensors and microphones, driving progress in the MEMS industry.
Do read about some of the most popular patents of Memsen Electronics which have been covered by us in this article and also you can find Memsen Electronics patents information, the worldwide patent filing activity and its patent filing trend over the years, and many other stats over Memsen Electronics patent portfolio.
How many patents does Memsen Electronics have?
Memsen Electronics has a total of 44 patents globally. These patents belong to 16 unique patent families. Out of 44 patents, 31 patents are active.
How Many Patents did Memsen Electronics File Every Year?
Are you wondering why there is a drop in patent filing for the last two years? It is because a patent application can take up to 18 months to get published. Certainly, it doesn’t suggest a decrease in the patent filing.
| Year of Patents Filing or Grant | Memsen Electronics Applications Filed | Memsen Electronics Patents Granted |
| 2023 | – | 1 |
| 2021 | 1 | 3 |
| 2020 | – | 1 |
| 2019 | 1 | 1 |
| 2018 | 4 | 5 |
| 2017 | – | 6 |
| 2016 | 6 | 2 |
| 2015 | 3 | 7 |
| 2014 | – | 2 |
How many Memsen Electronics patents are Alive/Dead?
Worldwide Patents
How Many Patents did Memsen Electronics File in Different Countries?
Countries in which Memsen Electronics Filed Patents
| Country | Patents |
| China | 16 |
| United States of America | 14 |
| Taiwan | 4 |
Where are Research Centers of Memsen Electronics Patents Located?
The Research Centers of Memsen Electronics Patents is China.
10 Best Memsen Electronics Patents
WO2012122872A1 is the most popular patent in the Memsen Electronics portfolio. It has received 37 citations so far from companies like Robert Bosch, Taiwan Semiconductor Manufacturing Company, Shanghai Anhan Medical Technology.
Below is the list of 10 most cited patents of Memsen Electronics:
| Publication Number | Citation Count |
| WO2012122872A1 | 37 |
| CN102156012A | 32 |
| WO2012122875A1 | 10 |
| US20160236931A1 | 8 |
| US9448251B2 | 6 |
| US9073746B2 | 6 |
| US20140001581A1 | 5 |
| WO2012122876A1 | 5 |
| US9738513B2 | 4 |
| WO2012122879A1 | 4 |
What Percentage of Memsen Electronics US Patent Applications were Granted?
Memsen Electronics (Excluding its subsidiaries) has filed 14 patent applications at USPTO so far (Excluding Design and PCT applications). Out of these 12 have been granted leading to a grant rate of 85.71%.
Below are the key stats of Memsen Electronics patent prosecution at the USPTO.
Which Law Firms Filed Most US Patents for Memsen Electronics?
| Law Firm | Total Applications | Success Rate |
| Cantor Colburn Llp | 14 | 85.71% |
List of Memsen Electronics patents
| Memsen Electronics Patents | Title |
| US11692892B2 | Mems Pressure Sensor And Method For Forming The Same |
| US10913093B2 | Micro-Electro-Mechanical System Piezoelectric Transducer And Method For Manufacturing The Same |
| US11002626B2 | Mems Pressure Sensor And Method For Forming The Same |
| CN108217581B | A Mems Piezoelectric Sensor And Manufacturing Method Thereof |
| US10591508B2 | Mems Inertial Sensor And Forming Method Therefor |
| TWI667815B | Micro-Electro-Mechanical System Piezoelectric Transducer And Method For Manufacturing The Same |
| US9949037B2 | Mems Microphone And Method For Forming The Same |
| US9958471B2 | Mems Inertial Sensor And Forming Method Therefor |
| CN104796832B | Mems Microphone And Method Of Forming The Same |
| TWI629460B | Mems Pressure Sensor And Method Of Forming The Same |
| TWI622759B | Mems Pressure Sensor And Method Of Forming The Same |
| US9674619B2 | Mems Microphone And Forming Method Therefor |
| US9738513B2 | Mems Pressure Sensor And Method For Forming The Same |
| US9633952B2 | Substrate Structure And Method For Manufacturing Same |
| CN104634487B | Mems Pressure Sensor And Method Of Forming The Same |
| CN104655334B | Mems Pressure Sensor And Method Of Forming The Same |
| TWI592030B | Mems Microphone And Method Of Forming The Same |
| US9448251B2 | Integrated Inertial Sensor And Pressure Sensor, And Forming Method Therefor |
| CN103391501B | Mems Microphone Structure And Its Manufacturing Method |
| US20160236931A1 | Mems Pressure Sensor And Method For Forming The Same |
| US9073746B2 | Mems Pressure Sensor And Manufacturing Method Therefor |
| US9073745B2 | Mems Pressure Sensor And Manufacturing Method Therefor |
| CN102539830B | Multi-Axis Sensor As Well As Manufacturing Method Thereof And Differential Sensor System |
| CN102183335B | Mems Pressure Sensor And Manufacturing Method Thereof |
| CN102158775B | Mems (Micro Electro Mechanical System) Microphone Packaging Structure And Forming Method Thereof |
| CN102158788B | Mems (Micro-Electromechanical Systems) Microphone And Formation Method Thereof |
| CN102158787B | Mems (Micro Electro Mechanical System) Microphone And Pressure Integration Sensor, And Manufacturing Method Thereof |
| CN102158789B | Mems (Micro Electro Mechanical System) Microphone Structure And Forming Method Thereof |
| CN102226999B | Substrate Structure And Manufacturing Method Thereof |
| US20140001581A1 | Mems Microphone And Forming Method Therefor |
| CN102156203B | Mems (Micro-Electromechanical System) Inertial Sensor And Forming Method Of Mems Inertial Sensor |
| CN102180435B | Integrated Micro Electro-Mechanical System (Mems) Device And Forming Method Thereof |
| CN102183677B | Integrated Inertial Sensor And Pressure Sensor And Forming Method Thereof |
| WO2012122869A1 | Mems Microphone And Forming Method Therefor |
| WO2012122876A1 | Integrated Mems Component And Forming Method Therefor |
| WO2012122871A1 | Mems Microphone And Forming Method Therefor |
| WO2012152104A1 | Substrate Structure And Method For Manufacturing Same |
| WO2012122868A1 | Micro-Electro-Mechanical System Microphone Packaging Structure And Forming Method Therefor |
| WO2012122872A1 | Mems Microphone And Integrated Pressure Sensor And Manufacturing Method Therefor |
| WO2012122878A1 | Integrated Inertial Sensor And Pressure Sensor, And Forming Method Therefor |
| WO2012122875A1 | Mems Pressure Sensor And Manufacturing Method Therefor |
| WO2012122877A1 | Mems Pressure Sensor And Manufacturing Method Therefor |
| WO2012122879A1 | Mems Inertial Sensor And Forming Method Therefor |
| CN102156012A | Micro Electromechanical System (Mems) Pressure Sensor And Manufacturing Method Thereof |
What are Memsen Electronics key innovation segments?
What Technologies are Covered by Memsen Electronics?
The chart below distributes patents filed by Memsen Electronics in different countries on the basis of the technology protected in patents. It also represents the markets where Memsen Electronics thinks it’s important to protect particular technology inventions.
R&D Focus: How has Memsen Electronics search focus changed over the years?
EXCLUSIVE INSIGHTS COMING SOON!
Interested in knowing about the areas of innovation that are being protected by Memsen Electronics?