Qualcomm has a total of 263708 patents globally, out of which 114046 have been granted. Of these 263708 patents, more than 62% patents are active. United States of America is where Qualcomm has filed the maximum number of patents, followed by Europe and China. Parallelly, USA seems to be the main focused R&D center and is also the origin country of Qualcomm.
Qualcomm was founded in 1985 by Irwin Jacobs and Andrew Viterbi. Qualcomm operates as a multinational semiconductor and telecommunications equipment company. The Company develops and delivers digital wireless communications products and services based on CDMA digital technology. Qualcomm serves customers worldwide. As of December 2021, Qualcomm has a market cap of $186.48 Billion.
Also, did you know that Qualcomm is the leading patent filer in Satellite Communication Industry! Click here to read more.
Do read about some of the most popular patents of Qualcomm which have been covered by us in this article and also you can find Qualcomm patents information, the worldwide patent filing activity and its patent filing trend over the years, and many other stats over Qualcomm patent portfolio.
How many patents does the CEO of Qualcomm have?
The CEO, Cristiano Amon has 0 patents.
How many patents does Qualcomm have?
Qualcomm has a total of 263708 patents globally. These patents belong to 73479 unique patent families. Out of 263708 patents, 163759 patents are active.
How many Qualcomm patents are Alive/Dead?
Worldwide Patents
Patent Families
How Many Patents did Qualcomm File Every Year?
Are you wondering why there is a drop in patent filing for the last two years? It is because a patent application can take up to 18 months to get published. Certainly, it doesn’t suggest a decrease in the patent filing.
| Year of Patents Filing or Grant | Qualcomm Applications Filed | Qualcomm Patents Granted |
| 2011 | 13348 | 5361 |
| 2012 | 14209 | 7440 |
| 2013 | 15602 | 9250 |
| 2014 | 18024 | 9131 |
| 2015 | 17842 | 9448 |
| 2016 | 17402 | 9535 |
| 2017 | 14549 | 8683 |
| 2018 | 13769 | 9123 |
| 2019 | 11383 | 8553 |
| 2020 | 10113 | 8147 |
| 2021 | 3934 | 7687 |
| 2022 | – | 7 |
How Many Patents did Qualcomm File in Different Countries?
Countries in which Qualcomm Filed Patents
| Country | Patents |
| United States Of America | 48327 |
| China | 25499 |
| Europe | 25261 |
| Japan | 22719 |
| India | 19175 |
| Korea (South) | 18720 |
| Taiwan | 12212 |
| Brazil | 7583 |
| Canada | 5374 |
| Australia | 4958 |
| Singapore | 3578 |
| Germany | 3303 |
| Spain | 3235 |
| Russian Federation | 3218 |
| Mexico | 3092 |
| Hong Kong (S.A.R.) | 2976 |
| Indonesia | 2520 |
| Israel | 2233 |
| Austria | 1812 |
| Hungary | 1401 |
| Viet Nam | 1360 |
| Malaysia | 1055 |
| Philippines | 940 |
| Ukraine | 851 |
| United Kingdom | 745 |
| Argentina | 722 |
| Thailand | 607 |
| Denmark | 569 |
| South Africa | 513 |
| Norway | 506 |
| Portugal | 427 |
| Poland | 387 |
| New Zealand | 374 |
| Turkey | 316 |
| Slovenia | 216 |
| Chile | 210 |
| Finland | 197 |
| Peru | 121 |
| Colombia | 121 |
| Saudi Arabia | 100 |
| African Regional Industrial Property Organization | 68 |
| Eurasian Patent Organization | 67 |
| France | 58 |
| Ecuador | 54 |
| Morocco | 51 |
| African Intellectual Property Organization | 42 |
| Tunisia | 34 |
| Cyprus | 27 |
| Costa Rica | 24 |
| Croatia | 21 |
| Czech Republic | 17 |
| Serbia | 14 |
| Dominican Republic | 14 |
| Cuba | 13 |
| Egypt | 13 |
| Guatemala | 11 |
| El Salvador | 11 |
| Jordan | 11 |
| Nicaragua | 10 |
| Uruguay | 10 |
| Romania | 9 |
| San Marino | 9 |
| Gulf Cooperation Council | 8 |
| Bulgaria | 6 |
| Slovakia | 5 |
| Montenegro | 4 |
| Netherlands | 4 |
| Italy | 4 |
| Lithuania | 3 |
| Mongolia | 3 |
| Sweden | 3 |
| Estonia | 2 |
| Switzerland | 2 |
| Yugoslavia/Serbia and Montenegro | 1 |
| Georgia | 1 |
| Greece | 1 |
| Algeria | 1 |
| Belgium | 1 |
Where are Research Centers of Qualcomm Patents Located?
10 Best Qualcomm Patents
US6674562B1 is the most popular patent in the Qualcomm portfolio. It has received 1569 citations so far from companies like Sharp Corporation, Apple and Magna Electronics.
Below is the list of 10 most cited patents of Qualcomm:
| Publication Number | Citation Count |
| US6674562B1 | 1569 |
| US6879596B1 | 1271 |
| US6473467B1 | 1269 |
| US6680792B2 | 1237 |
| US6199045B1 | 987 |
| US20030125040A1 | 918 |
| US6650455B2 | 895 |
| US6574211B2 | 874 |
| US6574033B1 | 870 |
| US6710908B2 | 849 |
Which Companies are using Qualcomm Patents to Advance their Research?
If patents or patents from a particular technology area of a company receive a lot of citations, it implies that the technology is being followed and incrementally innovated by the citing companies. It also indicates that citing companies are working on similar and closely related technologies.
The top citing companies in the Qualcomm patent portfolio are Samsung, LG and Ericsson.
List of the top forward citing Companies –
| Company | Number of Patents |
| Samsung | 4647 |
| LG | 2789 |
| Ericsson | 2488 |
| Intel | 2472 |
| Apple | 2122 |
| Huawei | 2034 |
| Nokia | 1508 |
| Sony | 1257 |
| Microsoft | 1238 |
| IBM | 1147 |
Count of 102 and 103 Type Rejections based on Qualcomm Patents
Top Qualcomm Patents used in Rejecting Most Patent Applications
| Patent Number | Count of Rejected Applications |
| US9384594B2 | 179 |
| US8659548B2 | 107 |
| US8312392B2 | 101 |
| US9557889B2 | 100 |
| US8539357B2 | 82 |
| US9772689B2 | 80 |
| US8325214B2 | 79 |
| US9646025B2 | 77 |
| US9544075B2 | 72 |
| US8593418B2 | 72 |
| US8539382B2 | 70 |
| US8803816B2 | 69 |
| US9986293B2 | 68 |
| US9359074B2 | 68 |
| US8855554B2 | 66 |
What Percentage of Qualcomm US Patent Applications were Granted?
Qualcomm (Excluding its subsidiaries) has filed 43211 patent applications at USPTO so far (Excluding Design and PCT applications). Out of these 31132 have been granted leading to a grant rate of 79.67%.
Below are the key stats of Qualcomm patent prosecution at the USPTO.
Which Law Firms Filed Most US Patents for Qualcomm?
| Law Firm | Total Applications | Success Rate |
| Qualcomm | 18280 | 76.18% |
| Holland & Hart | 2988 | 83.80% |
| Arent Fox | 2267 | 74.46% |
| Patterson Sheridan | 1796 | 79.56% |
| Shumaker & Sieffert | 1508 | 82.82% |
| Paradice And Li | 1462 | 74.03% |
| Loza & Loza Llp | 1456 | 75.48% |
| Muncy Geissler Olds & Lowe | 1258 | 66.06% |
| The Marbury Law Group | 933 | 65.43% |
| Harrity & Harrity | 735 | 91.76% |
Patents acquired by Qualcomm
Qualcomm has acquired 604 patents from other companies which are not associated with Qualcomm.
Below the chart shows the top 10 patent acquisitions of Qualcomm –
| Company | Patents Families |
| Hewlett-Packard | 162 |
| Palm Inc | 100 |
| TDK Corporation | 67 |
| Samsung | 40 |
| Siemens | 38 |
| Applied Micro Circuits Corporation | 37 |
| Philips | 23 |
| RF Micro Devices | 19 |
| Broadcom | 16 |
List of acquired patents of Qualcomm from 2015 onwards
| Publication Number | Title | Patent Acquired From |
| US8896380B2 | High Frequency Amplifier | TDK Corporation |
| US7965989B2 | High Frequency Module | TDK Corporation |
| US7978031B2 | High Frequency Module Provided With Power Amplifier | TDK Corporation |
| US7671705B2 | Surface Acoustic Wave Filter And Resonator Utilizing A Branch Electrode With An Electrically Opened End | TDK Corporation |
| US7847657B2 | Longitudinally Coupled Resonator-Type Surface Acoustic Wave Filter | TDK Corporation |
| US7504759B2 | Surface Acoustic Wave Element, Surface Acoustic Wave Device, Duplexer, And Method Of Making Surface Acoustic Wave Element | TDK Corporation |
| US7565116B2 | High Frequency Module | TDK Corporation |
| US7612634B2 | High Frequency Module Utilizing A Plurality Of Parallel Signal Paths | TDK Corporation |
| US7373171B2 | Front End Module | TDK Corporation |
| US7420438B2 | Front End Module | TDK Corporation |
| US7352114B2 | Surface Acoustic Wave Element, Surface Acoustic Wave Device, Surface Acoustic Wave Duplexer, And Method Of Manufacturing Surface Acoustic Wave Element | TDK Corporation |
| US7348714B2 | Piezoelectric Resonator, Filter And Electronic Component Using The Same | TDK Corporation |
| US7436051B2 | Component For Fabricating An Electronic Device And Method Of Fabricating An Electronic Device | TDK Corporation |
| US7414494B2 | Surface Acoustic Wave Apparatus | TDK Corporation |
| US7388453B2 | High Frequency Module | TDK Corporation |
| US7403082B2 | Dual Mode Antenna Switch Module | TDK Corporation |
| US7412210B2 | High Frequency Module | TDK Corporation |
| US7411333B2 | Surface Acoustic Wave Device | TDK Corporation |
| US7187254B2 | Film Bulk Acoustic Resonator Filters With A Coplanar Waveguide | TDK Corporation |
| US7239067B2 | Method Of Manufacturing A Piezoelectric Thin Film Resonator, Manufacturing Apparatus For A Piezoelectric Thin Film Resonator, Piezoelectric Thin Film Resonator, And Electronic Component | TDK Corporation |
| US7170370B2 | Filter Device Capable Of Obtaining Attenuation Characteristic Of Sharpness In Narrow Band Width And Branching Filter Using The Same | TDK Corporation |
| US7206551B2 | High Frequency Switch Module And Multi-Layer Substrate For High Frequency Switch Module | TDK Corporation |
| US7220995B2 | Substrate For Electronic Device, Electronic Device And Methods Of Manufacturing Same | TDK Corporation |
| US7212083B2 | Filter Device Utilizing Stacked Resonators And Acoustic Coupling And Branching Filter Using Same | TDK Corporation |
| US7236070B2 | Electronic Component Module And Manufacturing Method Thereof | TDK Corporation |
| US7199505B2 | Piezoelectric Resonator And Electronic Components Using The Same | TDK Corporation |
| US7298230B2 | Duplexer Utilizing A Compact Splitter Circuit | TDK Corporation |
| US7183879B2 | Electric Filter, And Duplexer Using The Same | TDK Corporation |
| US7173361B2 | Film Bulk Acoustic Wave Resonator | TDK Corporation |
| US7307494B2 | Multi-Branch Antenna Signal Separating Device | TDK Corporation |
| US7046103B2 | Electric Filter Comprising A Plurality Of Thin Film Bulk Acoustic Resonators | TDK Corporation |
| US7116187B2 | Saw Element And Saw Device | TDK Corporation |
| US7078984B2 | Duplexer And Method Of Manufacturing Same | TDK Corporation |
| US7038551B2 | Antenna Duplexer | TDK Corporation |
| US6989723B2 | Piezoelectric Resonant Filter And Duplexer | TDK Corporation |
| US7124485B2 | Method Of Manufacturing A Piezoelectric Thin Film Resonator | TDK Corporation |
| US7109637B2 | Thin-Film Bulk Acoustic Oscillator And Method Of Manufacturing Same | TDK Corporation |
| US7102461B2 | Surface Acoustic Wave Element, Surface Acoustic Wave Device, Surface Acoustic Wave Duplexer, And Method Of Manufacturing Surface Acoustic Wave Element | TDK Corporation |
| US7003875B2 | Method For Manufacturing Piezo-Resonator | TDK Corporation |
| US7042090B2 | Electronic Device And Method Of Fabricating The Same | TDK Corporation |
| US6995497B2 | Film Bulk Acoustic Resonator | TDK Corporation |
| US7126441B2 | Electronic Component Having A Connection Member Connecting A Resonator Terminal And A Mounting Substrate Electrode | TDK Corporation |
| US7116040B2 | Electronic Component And Filter Including The Same | TDK Corporation |
| US7105880B2 | Electronic Device And Method Of Fabricating The Same | TDK Corporation |
| US7075214B2 | Piezoelectric Resonator And Electronic Component Provided Therewith | TDK Corporation |
| US7148604B2 | Piezoelectric Resonator And Electronic Component Provided Therewith | TDK Corporation |
| US6946772B2 | Saw Element, Saw Device And Branching Filter | TDK Corporation |
| US6855996B2 | Electronic Device Substrate Structure And Electronic Device | TDK Corporation |
| US6977563B2 | Thin-Film Piezoelectric Resonator And Method For Fabricating The Same | TDK Corporation |
| US6954117B2 | Electronic Component Including Piezo-Electric Resonator Mounted By Face-Down Bonding With A Required Die Shear Strength | TDK Corporation |
| US6774746B2 | Thin Film Bulk Acoustic Resonator Filters With A Piezoelectric Layer Of Lead Scandium Tantalum Oxide | TDK Corporation |
| US6709776B2 | Multilayer Thin Film And Its Fabrication Process As Well As Electron Device | TDK Corporation |
| US6700300B2 | Surface Acoustic Wave Device And Piezoelectric Substrate Used Therefor | TDK Corporation |
| US6696736B2 | Piezoelectric Substrate For Surface Acoustic Wave Device, And Surface Acoustic Wave Device | TDK Corporation |
| US6778038B2 | Piezoelectric Resonant Filter, Duplexer, And Method Of Manufacturing Same | TDK Corporation |
| US6580198B2 | Surface Acoustic Wave Device Having A Thin Metal Oxide Film Fully Covering At Least The Electrodes And Method Of Fabricating Same | TDK Corporation |
| US6600385B2 | Front End Module For Mobile Communications Apparatus | TDK Corporation |
| US6628178B2 | Radio Frequency Module Parts Including Surface Acoustic Wave Elements And Manufacturing Method Thereof | TDK Corporation |
| US6623842B2 | Surface Electrode Structure On Ceramic Multi-Layer Substrate And Process For Producing The Same | TDK Corporation |
| US6407486B1 | Surface Acoustic Wave Device | TDK Corporation |
| US6452306B1 | Surface Acoustic Wave Device And Piezoelectric Substrate Used Therefor | TDK Corporation |
| US6316860B1 | Surface Acoustic Wave Device, And Its Fabrication Process | TDK Corporation |
| US6259187B1 | Piezoelectric Bulk Acoustic Wave Device | TDK Corporation |
| US6258459B1 | Multilayer Thin Film | TDK Corporation |
| US6255759B1 | Surface Acoustic Wave Device And Method Of Designing The Same | TDK Corporation |
| US6198208B1 | Thin Film Piezoelectric Device | TDK Corporation |
| US20070229191A1 | Surface Acoustic Wave Element And Surface Acoustic Wave Device Comprising The Element | TDK Corporation |
| US9179322B2 | System And Method For Allocating Spectrum Using Dynamically Adjusted Separation Distances For Mitigating Interference | Spectrum Bridge |
| US20150341798A1 | System And Method For Mapping Radio Spectrum Interests | Spectrum Bridge |
| US20140115637A1 | System And Method For Broadcast Reception Management | Spectrum Bridge |
| US20140215532A1 | System And Method For Delivering Media Content To Wireless Electronic Device | Spectrum Bridge |
| US8086214B2 | Electric Field Communication Apparatus, Electric Field Communication System, And Method Of Controlling Electric Field Communication Apparatus | Sony Ericsson |
| US7938586B2 | Mobile Terminal Apparatus And Sliding Cover Device | Sony Ericsson |
| US7778672B2 | Portable Electronic Device And Carrier Telephone Equipment | Sony Ericsson |
| US7619976B2 | Data Transmission Method And Data Transmission Apparatus | Sony Ericsson |
| US7599721B2 | Mobile Terminal Device Including An Elevating Keyboard Mechanism | Sony Ericsson |
| US7587683B2 | Display Method, Portable Terminal Device, And Display Program | Sony Ericsson |
| US7330518B2 | Distortion Compensation Circuit, And A Transmission Apparatus Including The Same | Sony Ericsson |
| US7372897B2 | Portable Information Communication Terminal, Program, And Recording Medium | Sony Ericsson |
| US7353052B2 | Mobile Terminal Apparatus | Sony Ericsson |
| US7426671B2 | Re-Transmission Controlling Method And Wireless Communication Terminal Apparatus | Sony Ericsson |
| US7221919B2 | Receiver Circuit And Radio Communication Terminal Apparatus | Sony Ericsson |
| US7259621B2 | Distortion Compensating Device And Power Amplifying Device With Distortion Compensating Function | Sony Ericsson |
| US7075384B2 | Delta-Sigma Modulated Fractional-N Pll Frequency Synthesizer And Wireless Communication Apparatus | Sony Ericsson |
| US7965976B2 | Information Processing Apparatus And Method And Computer Program | Sony |
| US7405728B2 | Portable Information Terminal, Program, And Recording Medium Having The Program Recorded Therein | Sony |
| US7446709B2 | Antenna Device And Mobile Terminal Apparatus Equipped With The Antenna Device | Sony |
| US7019571B2 | Frequency Synthesizer For A Wireless Communication System | Silicon Labs |
| US6528924B1 | Electronic Component, In Particular A Component Operating With Surface Acoustic Waves | Siemens |
| US6310420B1 | Electronic Component In Particular An Saw Component Operating With Surface Acoustic Waves And A Method For Its Production | Siemens |
| US6246302B1 | Reactance Filter With Surface Wave Resonators | Siemens |
| US6313715B1 | Saw Duplexer | Siemens |
| US7889123B1 | Global Positioning System (Gps) Assembly Test Using Wireless Transmission | RF Micro Devices |
| US7688883B1 | Received Signal Correlation Using A Correlation Scaling Factor | RF Micro Devices |
| US7852908B1 | Combined Digital Filter And Correlator | RF Micro Devices |
| US7495610B1 | System And Method For Decimating Global Positioning System Signals | RF Micro Devices |
| US7505744B1 | Dc Offset Correction Using Multiple Configurable Feedback Loops | RF Micro Devices |
| US7356074B2 | Estimation Of Multipath Channel With Sub-Chip Resolution | RF Micro Devices |
| US7167530B2 | Estimation And Correction Of Dc Offset In The Presence Of Frequency Offset | RF Micro Devices |
| US6990158B2 | Method And Apparatus For Multipath Signal Compensation In Spread-Spectrum Communications Systems | RF Micro Devices |
| US6700929B1 | Method And Apparatus For Multipath Parameter Estimation In Spread-Spectrum Communications Systems | RF Micro Devices |
| US6683905B1 | Dual-Mode Receiver | RF Micro Devices |
| US6693954B1 | Apparatus And Method Of Early-Late Symbol Tracking For A Complementary Code Keying Receiver | RF Micro Devices |
| US6647077B1 | Multipath Parameter Estimation In Spread-Spectrum Communications Systems | RF Micro Devices |
| US6661834B1 | Carrier Recovery For Spread Spectrum Communications | RF Micro Devices |
| US7042257B2 | Frequency Divider With Reduced Jitter And Transmitter Based Thereon | Philips |
| US6914489B2 | Voltage-Controlled Oscillator Presetting Circuit | Philips |
| US6801794B2 | Operating State Based Energy-Saving Display Device | Philips |
| US6700435B2 | Local Supply Generator For A Digital Cmos Integrated Circuit Having An Analog Signal Processing Circuitry | Philips |
| US6624675B2 | Free-Running Mode Device For Phase Locked Loop | Philips |
| US6642794B2 | Noise And Input Impedance Matched Amplifier | Philips |
| US6650169B2 | Gate Driver Apparatus Having An Energy Recovering Circuit | Philips |
| US6438700B1 | System And Method To Reduce Power Consumption In Advanced Risc Machine (Arm) Based Systems | Philips |
| US7532194B2 | Driver Voltage Adjuster | IDC Llc |
| US7554714B2 | Device And Method For Manipulation Of Thermal Response In A Modulator | IDC Llc |
| US7550912B2 | Method And System For Maintaining Partial Vacuum In Display Device | IDC Llc |
| US7492502B2 | Method Of Fabricating A Free-Standing Microstructure | IDC Llc |
| USRE40436E1 | Hermetic Seal And Method To Create The Same | IDC Llc |
| US7446926B2 | System And Method Of Providing A Regenerating Protective Coating In A Mems Device | IDC Llc |
| US7420728B2 | Methods Of Fabricating Interferometric Modulators By Selectively Removing A Material | IDC Llc |
| US7299681B2 | Method And System For Detecting Leak In Electronic Devices | IDC Llc |
| US7161730B2 | System And Method For Providing Thermal Compensation For An Interferometric Modulator Display | IDC Llc |
| US7119945B2 | Altering Temporal Response Of Microelectromechanical Elements | IDC Llc |
| US7933584B2 | Method For Implementing Security Update Of Mobile Station And A Correlative Reacting System | Huawei |
| US7822407B2 | Method For Selecting The Authentication Manner At The Network Side | Huawei |
| US7719562B2 | Method And System For Handling Multimedia Calls | Huawei |
| US20120100823A1 | Method, System, Network Side Device, And Ue Of Managing Csg Membership | Huawei |
| US20110088051A1 | Method, Apparatus And System For Recommending Media Content | Huawei |
| US20100107086A1 | Method And System For Generating Report Condition Input Interface | Huawei |
| US20100136993A1 | Method And Apparatus For Releasing Reserved Resources | Huawei |
| US20090022221A1 | Method For Video Layered Coding, Device For Coding And Decoding In Interlaced Mode | Huawei |
| US20080270511A1 | Method And System For Managing Home Network | Huawei |
| US20060109827A1 | Method For Transmitting Service Data To Wireless Local Area Network Users | Huawei |
| US20050265296A1 | Method, A System And A Terminal For Realizing Presenting Information Interaction Of The Wireless Lan Users | Huawei |
| US7990412B2 | Systems And Methods For Correcting Image Perspective | Hewlett-Packard |
| US7924310B1 | Image Data Processing Methods, Image Data Processing Systems, And Articles Of Manufacture | Hewlett-Packard |
| US7742625B2 | Autonomous Camera Having Exchangable Behaviours | Hewlett-Packard |
| US7843495B2 | Face Recognition In A Digital Imaging System Accessing A Database Of People | Hewlett-Packard |
| US7511838B2 | Method And Apparatus For Reviewing Captured Images | Hewlett-Packard |
| US7548689B2 | Image Processing Method | Hewlett-Packard |
| US7403301B2 | System And Method For Collecting And Analyzing Information Regarding User Devices | Hewlett-Packard |
| US7251048B2 | Recording Images Together With Link Information | Hewlett-Packard |
| US7187412B1 | Pointing Device For Digital Camera Display | Hewlett-Packard |
| US7312821B2 | Time-Sliced Still Image Generation | Hewlett-Packard |
| US7139018B2 | Synchronized Cameras With Auto-Exchange | Hewlett-Packard |
| US7102670B2 | Bookmarking Captured Digital Images At An Event To All Present Devices | Hewlett-Packard |
| US7079707B2 | System And Method For Horizon Correction Within Images | Hewlett-Packard |
| US7023475B2 | System And Method For Identifying An Object With Captured Images | Hewlett-Packard |
| US7123295B2 | Memory Management In An Image Capturing Device | Hewlett-Packard |
| US6900835B2 | Method And Apparatus For Prioritizing Menu Items Of An Electronic Device | Hewlett-Packard |
| US9099968B2 | Bias Control Circuit | TDK Corporation |
| US8948801B2 | Systems And Methods For Provisioning And Allocating A Commoditized Spectrum Object | Spectrum Bridge |
| US8929937B2 | Managing Spectrum Resources Using Channel Maps And Predicted Noise Floor | Spectrum Bridge |
| US8804680B2 | System And Method For Managing Wireless Connections And Radio Resources | Spectrum Bridge |
| US8831625B2 | Systems And Methods For Processing Spectrum Coexistence Information To Optimize Spectrum Allocation | Spectrum Bridge |
| US8792901B2 | System And Method For Assessing Radio Sensing Data | Spectrum Bridge |
| US8539249B2 | System And Method For Security Authentication Using Biometric Authentication Technique | Huawei |
| US8559973B2 | Mode Of Operation Based On Image Capture Profile | Hewlett-Packard |
| US7545428B2 | System And Method For Managing Digital Images | Spectrum Bridge |
| US20140078403A1 | System And Method For Broadcast Reception Management | Spectrum Bridge |
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G, and 5G smartphone. Company bring the benefits of mobile to new industries, including automotive, the internet of things, and computing.
Qualcomm continues to spearhead research for the 5G evolution—the latest global wireless standards. These R&D efforts are leading to the invention of technologies that will unlock the full potential of 5G and enable an even more intelligently connected future.
Cybertrust Japan, SB Technology Corp, and Qualcomm intend to collaborate to support the deployment of smart solutions through the Qualcomm® IoT Services Suite offering to help businesses and entities looking to adopt and integrate smart solutions initially in Japan, with intent to expand globally in the future.
Leading industry innovators Vodafone, Qualcomm Technologies, Inc., and Thales have joined forces to demonstrate a working smartphone featuring iSIM (based on the ieUICC[1] GSMA specification), iSIM is a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for the commercialization of the technology, which could be rolled out in a host of new devices. iSIM is the latest evolution of SIM technology in which ‘eSIMs’ are embedded into devices.
iSIM technology is a significant evolution on existing eSIM solutions and delivers wholesale benefits to both consumers and telecommunications operators. iSIMs enable mobile services to be integrated into devices beyond the mobile phone, such as laptops, virtual reality platforms, IoT devices, wearables, and more.
EXCLUSIVE INSIGHTS COMING SOON!
What are Qualcomm’s key innovation segments?
What Technologies are Covered by Qualcomm?
The chart below distributes patents filed by Qualcomm in different countries on the basis of the technology protected in patents. It also represents the markets where Qualcomm thinks it’s important to protect particular technology inventions.
R&D Focus: How Qualcomm search focus changed over the years?
EXCLUSIVE INSIGHTS COMING SOON!
Interested in knowing about the areas of innovation that are being protected by Qualcomm?